Home > Thermal Gap Filler >

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Product Categories

Phase Changing Materials [38]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [46]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Name: Hard Drive CPU GPU Thermal Gap Filler 1W 15mm 2mm 3mm for Heat Capacity 1 l gK
Brand: ZIITEK
Price: 1 USD

Wholesale Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K from china suppliers

Brand Name : ZIITEK

Model Number : TIF100-16-38UF

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : LED Light 2.5 W/m.k Thermal Silicon Pad Thermal Conductive Pad Thermal Gap Pad With Thermal Management Solution

Thickness : Available In Varies Thicknes

Keywords : Thermal Gap Pad

Hardness : 80±5 Shore 00

Construction & Compostion : Ceramic filled silicone rubber

Specific Gravity : 2.1 g/cc

Heat Capacity : 1 l /g-K

Thermal conductivity : 1.6W/mK

Contact Now

Manufacturer Supplier Custom Laptop 1.W 1mm 1.5mm 2mm 3mm Hard Drive Cpu GPU Thermal Gap Filler

The TIF100-16-38UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-16-38UF-Series-Datasheet-rev3.pdf

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K
Features:

> Good thermal conductive: 1.6 W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions

Typical Properties of TIF100-16-38UF Series
Color	Pink	Visual	Composite Thickness	hermalImpedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.36
			20mils / 0.508 mm	0.41
Specific Gravity	2.1 g/cc	ASTM D297	30mils / 0.762 mm	0.47
			40mils / 1.016 mm	0.52
Heat Capacity	1 l /g-K	ASTM C351	50mils / 1.270 mm	0.58
			60mils / 1.524 mm	0.65
Hardness	65 Shore 00	ASTM 2240	70mils / 1.778 mm	0.72
			80mils / 2.032 mm	0.79
Tensile Strength	45 psi	ASTM D412	90mils / 2.286 mm	0.87
			100mils / 2.540 mm	0.94
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	1.01
			120mils / 3.048 mm	1.09
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.17
			140mils / 3.556 mm	1.24
Dielectric Constant	5.5 MHz	ASTM D150	150mils / 3.810 mm	1.34
			160mils / 4.064 mm	1.42
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.50
			180mils / 4.572 mm	1.60
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.68
			200mils / 5.080 mm	1.77
Thermal conductivity	1.6W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Product Tags:

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K

GPU Thermal Gap Filler

CPU Thermal Gap Filler

3mm Thermal Gap Filler

Hard Drive CPU GPU Thermal Gap Filler 1.W 1.5mm 2mm 3mm for Heat Capacity 1 l /g-K Images