4.5mmT notebook applicated ultra soft thermal conductive pad 20 SHORE00 1.8W/m-K
The TIF5180-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
TIF500-18-11US Datasheet-REV02.pdf
Features:
> Good thermal conductive: 1.8W/mK
>Thickness:4.5mmT
>Outstanding thermal performance
>Easy release construction
>Electrically isolating
>RoHS compliant
Applications:
>notebook
>power supply
>LED Controller
>LED Ceilinglamp
>Monitoring the Power Box
>RDRAM memory modules
>Micro heat pipe thermal solutions
>Automotive engine control units
Typical Properties of TIF™5180-18-11US |
| Color | Grey | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
| Specific Gravity | 2.8 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 |
| Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 |
| Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 |
Thickness
| 4.5mmT | *** | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 |
| Dielectric Constant | 4.2 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
FACTORY INFORMATION:
Factory Size
5,000-10,000 square meters
Factory Country/Region
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Annual Output Value
US$1 Million - US$2.5 Million
FAQ
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Product Tags:
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4.5mmT Notebook Ultra Soft Thermal Conductive Pad 20 SHORE00 1.8W/M-K Images
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