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Dongguan Ziitek Electronic Materials & Technology Ltd.
Ziitek Thermal Conductive Materials & Technology Ltd Professional TIM Manufacturer
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Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

Dongguan Ziitek Electronic Materials & Technology Ltd.
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Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

Brand Name : Ziitek
Model Number : TIC™808G series
Certification : RoHs
Place of Origin : China
MOQ : 1000PCS
Price : negotiation
Supply Ability : 100000pcs/day
Delivery Time : 3-5 work days
Packaging Details : 1000pcs/bay
Product Name : Phase Changing Materials
Color : Gray
Thermal Conductivity : 5.0 W/mK
Density : 2.6g/cc
Temperature range : -25℃~125℃
Thickness : 0.127~0.25mmT
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Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials


TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Applications Include:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs


Features:


For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required


Typical Properties of TICTM800G Series
Product NameTICTM805GTICTM808GTICTM810GTICTM812GTest Method
ColorGrayGrayGrayGrayVisual
Thickness0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density2.6g/ccHelium Pycnometer
Temperature range-25℃~125℃ 
Phase Change Softening Temperature50℃~60℃ 
"Burn In" Temperature70℃ for 5 minutes 
Thermal Conductivity5.0 W/mKASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa)0.014℃-in²/W0.020℃-in²/W0.038℃-in²/W0.058℃-in²/WASTM D5470 (modified)
0.09℃-cm²/W0.13℃-cm²/W0.25℃-cm²/W0.37℃-cm²/W

Standard Thicknesses:


0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.


Standard Sizes:


10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.



Product Tags:

thermal insulating materials

      

heat sensitive materials

      
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