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Dongguan Ziitek Electronic Materials & Technology Ltd.
Ziitek Thermal Conductive Materials & Technology Ltd Professional TIM Manufacturer
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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W thermal resistance No heat sink preheating required

Dongguan Ziitek Electronic Materials & Technology Ltd.
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Dongguan Ziitek Electronic Materials & Technology Ltd.
City: Dongguan
Province/State: Guangdong
Country/Region: China
Tel: 86-0769-38801208
Contact Person:
Miss Dana

IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W thermal resistance No heat sink preheating required

Brand Name : Ziitek
Model Number : TIC™800Y
Certification : RoHs
Place of Origin : China
MOQ : 1000PCS
Price : negotiation
Supply Ability : 100000pcs/day
Delivery Time : 3-5days
Packaging Details : 1000pcs/bay
Product Name : Phase Changing Materials
Color : Yellow
Thermal Conductivity : 0.95 W/mK
phase transition temperature : 50℃~60℃
Thickness : 0.127mm~0.25mmT
Density : 2.2g/cc
Setting temperature : 70℃ for 5 minutes
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IGBTs Phase Change Material Heat Sink 0.024℃-in² / W With Low Thermal Resistance


The TIC™800Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


The TIC™800Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Features:


> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication


Typical Properties of TIC™800Y Series
Product Name
TICTM803Y
TICTM805Y
TICTM808Y
TICTM810Y
Testing standards
Color
Yellow
Yellow
Yellow
Yellow
Visual
Composite Thickness

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.2g/cc
Helium Pycnometer
Work temperature
-25℃~125℃
 
phase transition temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
0.95 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)
0.021℃-in²/W
0.024℃-in²/W
0.053℃-in²/W
0.080℃-in²/W
ASTM D5470 (modified)
0.14℃-cm²/W
0.15℃-cm²/W
0.34℃-cm²/W
0.52℃-cm²/W
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.

Product Tags:

thermal insulating materials

      

heat sensitive materials

      
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IGBTs Low Thermal Resistance Phase Change Material 0.024℃-in² / W thermal resistance No heat sink preheating required Images

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