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Ziitek Thermal Conductive Materials & Technology Ltd Professional TIM Manufacturer
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Dongguan Ziitek Electronic Materials & Technology Ltd.
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Dongguan Ziitek Electronic Materials & Technology Ltd.
City: Dongguan
Province/State: Guangdong
Country/Region: China
Tel: 86--18153789196
Contact Person:
Miss Dana

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Brand Name : Ziitek
Model Number : TIC™803Y series
Certification : RoHs
Place of Origin : China
MOQ : 1000PCS
Price : negotiation
Supply Ability : 100000pcs/day
Delivery Time : 3-5 work days
Packaging Details : 1000pcs/bay
Product Name : Phase Changing Materials
Color : Yellow
Thermal Conductivity : 0.95 W/mK
Density : 2.2g/cc
Temperature range : -25℃~125℃
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W


The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Features:


No heat sink preheating required
Low thermal resistance
Ease of use for high volume manufacturing
High thixotropic index
Dry to the touch for pre-apply applications
High thermal reliability, minimal pump out
Re-flow compatible
Cost Effective
Used where electrical isolation is not required
Low volatility – less than 1%
Easy to handle in the manufacturing environment
Flows but doesn’t run like grease
Available in custom die-cut shapes, kiss-cut on rolls

Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication


Typical Properties of TIC™800Y Series
Product NameTICTM803YTICTM805YTICTM808YTICTM810YTesting standards
ColorYellowYellowYellowYellowVisual
Composite Thickness

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density2.2g/ccHelium Pycnometer
Work temperature-25℃~125℃ 
phase transition temperature50℃~60℃ 
Setting temperature70℃ for 5 minutes 
Thermal conductivity0.95 W/mKASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)0.021℃-in²/W0.024℃-in²/W0.053℃-in²/W0.080℃-in²/WASTM D5470 (modified)
0.14℃-cm²/W0.15℃-cm²/W0.34℃-cm²/W0.52℃-cm²/W
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.

Product Tags:

thermal insulating materials

      

heat sensitive materials

      
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W Images

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