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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

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Dongguan Ziitek Electronic Materials & Technology Ltd.
City: Dongguan
Province/State: Guangdong
Country/Region: China
Tel: 86--18153789196
Contact Person:
Miss Dana

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Brand Name : Ziitek
Model Number : TIC™803Y series
Certification : RoHs
Place of Origin : China
MOQ : 1000PCS
Price : negotiation
Supply Ability : 100000pcs/day
Delivery Time : 3-5 work days
Packaging Details : 1000pcs/bay
Product Name : Phase Changing Materials
Color : Yellow
Thermal Conductivity : 0.95 W/mK
Density : 2.2g/cc
Temperature range : -25℃~125℃
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


No heat sink preheating required
Low thermal resistance
Ease of use for high volume manufacturing
High thixotropic index
Dry to the touch for pre-apply applications
High thermal reliability, minimal pump out
Re-flow compatible
Cost Effective
Used where electrical isolation is not required
Low volatility – less than 1%
Easy to handle in the manufacturing environment
Flows but doesn’t run like grease
Available in custom die-cut shapes, kiss-cut on rolls


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips

> Telecommunication

Typical Properties of TIC™800Y Series
Product NameTICTM803YTICTM805YTICTM808YTICTM810YTesting standards
Composite Thickness

Thickness Tolerance±0.0006"
Density2.2g/ccHelium Pycnometer
Work temperature-25℃~125℃ 
phase transition temperature50℃~60℃ 
Setting temperature70℃ for 5 minutes 
Thermal conductivity0.95 W/mKASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)0.021℃-in²/W0.024℃-in²/W0.053℃-in²/W0.080℃-in²/WASTM D5470 (modified)
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.


No reinforcement is necessary.

Product Tags:

thermal insulating materials


heat sensitive materials

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