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Ziitek Thermal Conductive Materials & Technology Ltd Professional TIM Manufacturer
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Low Shrinkage Heat Conductive Adhesive , 1.2W/mK LED Heatsink Adhesives and Sealants

Dongguan Ziitek Electronic Materials & Technology Ltd.
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Low Shrinkage Heat Conductive Adhesive , 1.2W/mK LED Heatsink Adhesives and Sealants

Brand Name : Ziitek
Model Number : TIS580-12
Certification : RoHs
Place of Origin : China
MOQ : 25PC
Supply Ability : 1000PC/Day
Delivery Time : 2-3 work day
Packaging Details : 300ml/1PC
packing : 300ml/1PC
Appearance : White paste
Hardness : 25(Shore A)
Peel Strength : >3.5(N/mm)
Operation temperature : -60~250(℃)
Thermal Conductivity : 1.2W/(m·K)
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Low Shrinkage Heat Conductive Adhesive , 1.2W/mK LED Heatsink Adhesives and Sealants

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

Feature


> Good thermal conductivity: 1.2W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance

Application

It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-12, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers

Typical values of TISTM580-12
AppearanceWhite pasteTest Method
Density(g/cm3,25℃)1.2ASTM D297
Tack-free time(min,25℃)≤20*****
Cure type(1-component)Dealcoholized*****
Viscosity@25℃ Brookfield (Uncured)5000 cpsASTM D1084
Total cure time(d, 25℃)3-7*****
Elongation(%)≥150ASTM D412
Hardness(Shore A)25ASTM D2240
Lap Shear Strength(MPa)≥2.0ASTM D1876
Peel Strength(N/mm)>3.5ASTM D1876
Operation temperature(℃)-60~250*****
Volume Resistivity(Ω·cm)2.0×1016ASTM D257
Dielectric Strength(KV/mm)21ASTM D149
Dielectric Constant (1.2MHz)2.9ASTM D150
Thermal Conductivity W/(m·K)1.2ASTM D5470
Flame RetardancyUL94 V-0E331100















Product Tags:

high temperature adhesive

      

acrylic based adhesive

      
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